• To drive or facilitate new product/package qualification.
• To ensure new product introduction is fully prepared for product manufacturability, enabling required QCD, including rapid time to market.
• To manage production ramp-up for a new product in an established source and is responsible to manage product transfers in an established source (FAB, Test, and Assembly).
• To provide yield monitoring and analysis in cooperation with Manufacturing, Wafer fab and Test Engineer, etc.
• To drive and facilitate product and yield improvements in term of cost (test parameter reduction and test stage elimination), quality, delivery and related technical issues.
• To drive and continuously improve product manufacturability, including time to yield, R&R improvement, hold lot prevention, product-process fit, test time reduction, etc.
• To apply technical knowledge for problem solving in developing or manufacturing environment.
• To provide systemic analysis, organization and review of various manufacturing and electrical data sources to establish solutions for product improvement.