Process Engineer - Wire bond / Die bond - บริษัท ลูเมนตั้ม อินเตอร์เนชั่นแนล (ประเทศไทย) จำกัด

Responsibilities

Develop, configure, and optimize manufacturing processes.
Assess process performance, collect measurements, and interpret data.
Design, execute, test, and improve systems and processes.
Develop best practices, standardized routines, and innovative solutions to improve production rates and product quality.
Perform process simulations and analyze results.
Manage cost and schedule constraints effectively.
Conduct risk assessments and implement mitigation plans.
Prepare and maintain process documentation and operating instructions.
Analyze and resolve complex technical problems.
Collaborate effectively with customers and cross-functional teams within Lumentum, including R&D, Product Engineering, and Product Line Management, to validate requirements and ensure process and technology milestones are clearly defined and achieved.
Ensure compliance with quality assurance procedures and industry best practices.
Coach, mentor, and motivate team members.

Bachelor's degree in engineering or a related scientific discipline.
7–12 years of experience in Die Bond and Wire Bond processes within a fast-paced electronics manufacturing environment, preferably in the semiconductor or optoelectronics industry.
Knowledge of telecom/datacom transceiver module products is a plus.
Familiarity with Design of Experiments (DOE) and Statistical Process Control (SPC).
Knowledge of QCFC, PFMEA, SPC, 8D problem-solving methodology, statistical analysis, data analysis tools (e.g., Minitab or JMP), and Lean Manufacturing/Six Sigma is a plus.
Creative thinker with strong analytical, problem-solving, and project management skills.
Ability to work effectively in cross-functional teams and interact with all levels of management.
Strong leadership, interpersonal, written, and verbal communication skills.
Willingness to participate in meetings across multiple time zones and travel internationally on occasion.

Process Engineer - Wire bond / Die bond

ปริญญาตรีหรือสูงกว่า

สามารถเจรจาต่อรองได้

7-12 ปี

2 วันที่แล้ว

รายละเอียดงาน

หน้าที่และความรับผิดชอบ

Develop, configure, and optimize manufacturing processes.
Assess process performance, collect measurements, and interpret data.
Design, execute, test, and improve systems and processes.
Develop best practices, standardized routines, and innovative solutions to improve production rates and product quality.
Perform process simulations and analyze results.
Manage cost and schedule constraints effectively.
Conduct risk assessments and implement mitigation plans.
Prepare and maintain process documentation and operating instructions.
Analyze and resolve complex technical problems.
Collaborate effectively with customers and cross-functional teams within Lumentum, including R&D, Product Engineering, and Product Line Management, to validate requirements and ensure process and technology milestones are clearly defined and achieved.
Ensure compliance with quality assurance procedures and industry best practices.
Coach, mentor, and motivate team members.

คุณสมบัติ

Bachelor's degree in engineering or a related scientific discipline.
7–12 years of experience in Die Bond and Wire Bond processes within a fast-paced electronics manufacturing environment, preferably in the semiconductor or optoelectronics industry.
Knowledge of telecom/datacom transceiver module products is a plus.
Familiarity with Design of Experiments (DOE) and Statistical Process Control (SPC).
Knowledge of QCFC, PFMEA, SPC, 8D problem-solving methodology, statistical analysis, data analysis tools (e.g., Minitab or JMP), and Lean Manufacturing/Six Sigma is a plus.
Creative thinker with strong analytical, problem-solving, and project management skills.
Ability to work effectively in cross-functional teams and interact with all levels of management.
Strong leadership, interpersonal, written, and verbal communication skills.
Willingness to participate in meetings across multiple time zones and travel internationally on occasion.

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