Semiconductor Equipment Engineer

•    Perform daily maintenance and debugging of Die Bonding machines, wire bonding machines, laser cutting equipment, and other related devices;
•    Conduct process debugging for new equipment in the assigned process, follow up on process validation results, and summarize relevant data and reports;
•    Analyze yield fluctuations in the assigned process, investigate the causes of abnormalities, and develop improvement measures;
•    Optimize and improve the efficiency of the assigned process, proactively promoting the implementation of efficiency optimization measures;
•    Train operators for the assigned process, and prepare, update, and follow up on relevant operational documents to ensure that employees' operations comply with document requirements;
•    Responsible for the setup of process equipment and optimization validation of fixtures and jigs.

•    Junior college or above; 
•    Good communication skills in English, Chinese is an add advantage;  
•    Good personality and communication skills, strong learning ability. Familiarity with the processes of optical communication products is preferred, or relevant experience in similar IC and semiconductor companies;
•    Knowledge of Die bonding and wire bonding processes for optical communication products is preferred, or experience in Die bonding and wire bonding in the electronics industry, such as mobile phone cameras, IC, and semiconductor industries;
•    Experience with Japanese FT Die bonding machines, American MRSI Die bonding machines, American K&S wire bonding machines, or similar Die bonding equipment is preferred;
•    Familiarity with the maintenance processes and methods of automated equipment, and a certain level of understanding of the structure and control principles of automated equipment.