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Application Engineer - YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD

YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD · Pathumthani

Location
Pathumthani
Salary
Negotiable
Job Type
Full Time
Work Type
Onsite
Education
Bachelor's Degree
Posted
01/07/2026

Responsibilities

  • Improvement and confirm machine function by SEM, Oscilloscope, etc.
  • Test bonding and evaluation to compare machine capability with competitor (Benchmark to check machine capability)
  • Verify problem and improve the customer product parameter as customer requirement (Low ball shear test, non-sticking, no tail, etc.)
  • Making technical report and propose to coordinate with concern department for support customer requirement
  • Adjust and optimize the wire bonder machine to support the customer’s device to achieve bonding spec
  • Setup and modify wire bonder machine by follow drawing from design
  • Adjust and optimize bond parameter to support the product of each customer (support production department)
  • Maesurement to confirm wire bonding quality (Ball size, BST, WPT, IMC, SEM, etc.)

Qualifications

  1. Education
    • Bachelor of Electrical and Electronics Engineering
    • Bachelor of Mechatronics Engineering (Mainly Electronics)
  2. Experience wire bonder application engineer of field engineer have experience in wire bond process is prefer
  3. 2 years or more experience in equipment/process semiconductor manufacturing
  4. Have knowledge and able to operate Wire bonder machine

Other attributions
  • Able to business trip domestic and overseas at customer factory
  • If have experience in wire bond process will given special consideration

Welfare
1. Perfect Attendance Allowance 
2. Uniform
3. Medical Expense   
4. Group insurance
5. Food allowance   
6. Provident fund
7. Company minibus   
8. Bonus

Remark:
All usage applications and making documents in English

Contact :Ms.Premchit/Ms.Nanthana/Ms.Naticha  02-529-6285-88
Can apply for a job at the company page

Benefits

  • Bonus
  • Company minibus
  • Food allowance
  • Group insurance
  • Medical Expense
  • Perfect Attendance Allowance
  • Uniform
  • Provident Fund
  • ค่ารักษาพยาบาล 10,000 บาท (รวมครอบครัวสายตรง)
  • 5-day work week
  • Social security
  • Accident Insurance
  • Annual trip or party
  • Attendance bonus or other special compensation

About YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD

YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD commands the top global share as a manufacturer of bonders for the assembly process of semiconductor manufacturing (packaging). In a dramatically changing semiconductor industry, the company has met the expectations of the world's semiconductor manufacturers for more than fifty years as a reliable brand.

83/44 Moo 19 Nava Nakorn Industrial Zone Phaholyothin Rd., Klong Nueng, Klong Luang, Pathumthani 12120

คุณวัชรินทร์ / คุณธณิกา / คุณอัญชลี

0-2529-6285-88

YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD
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What you will do
Responsibilities
  • Improvement and confirm machine function by SEM, Oscilloscope, etc.
  • Test bonding and evaluation to compare machine capability with competitor (Benchmark to check machine capability)
  • Verify problem and improve the customer product parameter as customer requirement (Low ball shear test, non-sticking, no tail, etc.)
  • Making technical report and propose to coordinate with concern department for support customer requirement
  • Adjust and optimize the wire bonder machine to support the customer’s device to achieve bonding spec
  • Setup and modify wire bonder machine by follow drawing from design
  • Adjust and optimize bond parameter to support the product of each customer (support production department)
  • Maesurement to confirm wire bonding quality (Ball size, BST, WPT, IMC, SEM, etc.)
Qualifications
  1. Education
    • Bachelor of Electrical and Electronics Engineering
    • Bachelor of Mechatronics Engineering (Mainly Electronics)
  2. Experience wire bonder application engineer of field engineer have experience in wire bond process is prefer
  3. 2 years or more experience in equipment/process semiconductor manufacturing
  4. Have knowledge and able to operate Wire bonder machine

Other attributions
  • Able to business trip domestic and overseas at customer factory
  • If have experience in wire bond process will given special consideration

Welfare
1. Perfect Attendance Allowance 
2. Uniform
3. Medical Expense   
4. Group insurance
5. Food allowance   
6. Provident fund
7. Company minibus   
8. Bonus

Remark:
All usage applications and making documents in English

Contact :Ms.Premchit/Ms.Nanthana/Ms.Naticha  02-529-6285-88
Can apply for a job at the company page

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ฝ่ายผลิต / ผลิตภัณฑ์

>1 year, Current

"งานมีความท้าทาย "

Welfare
  • Bonus
  • Company minibus
  • Food allowance
  • Group insurance
  • Medical Expense
  • Perfect Attendance Allowance
  • Uniform
  • Provident Fund
  • ค่ารักษาพยาบาล 10,000 บาท (รวมครอบครัวสายตรง)
  • 5-day work week
  • Social security
  • Accident Insurance
  • Annual trip or party
  • Attendance bonus or other special compensation

About Company

YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD commands the top global share as a manufacturer of bonders for the assembly process of semiconductor manufacturing (packaging). In a dramatically changing semiconductor industry, the company has met the expectations of the world's semiconductor manufacturers for more than fifty years as a reliable brand.

Location

83/44 Moo 19 Nava Nakorn Industrial Zone Phaholyothin Rd., Klong Nueng, Klong Luang, Pathumthani 12120

Contact person

คุณวัชรินทร์ / คุณธณิกา / คุณอัญชลี

Telephone

0-2529-6285-88