Application Design - YAMAHA ROBOTICS MANUFACTURING ASIA CO., LTD

In this Application Design Engineer role, you will contribute to improving and confirming machine functions using specialized tools like SEM and Oscilloscope. You will conduct bonding tests and evaluate machine capabilities, benchmarking against competitors to ensure optimal performance. Your responsibilities will include verifying problems and enhancing customer product parameters to meet specific requirements, as well as preparing technical reports and coordinating with relevant departments to support customer needs. Furthermore, you will adjust and optimize wire bonder machines to accommodate customer devices and achieve bonding specifications. This involves setting up and modifying wire bonder machines according to design drawings, fine-tuning bond parameters to support various customer products, and meticulously measuring wire bonding quality to confirm adherence to established standards. This opportunity is ideal for individuals eager to learn and develop skills in semiconductor manufacturing engineering.