Senior Engineer Process Development (Lapping / Surface Finishing)
บริษัท ซีเกท เทคโนโลยี (ประเทศไทย) จำกัด- Process Strategy: Lead end-to-end process development for lapping small form factor substrates to ensure ultra-high dimensional accuracy.
- Optimization: Fine-tune key parameters (applied pressure, rotation profiles, carrier design, and lubricant systems) to minimize variation and mechanical stress.
- Automation: Drive the design and implementation of automation solutions specifically for miniaturized substrate dimensions.
- Data-Driven Solutions: Analyze process performance to identify yield gaps and lead root-cause investigations (RCAs) to implement corrective actions.
- Quality & Standards: Maintain thorough documentation, including process flows, control plans, and engineering change management.
- Education: Bachelor’s degree or higher in Mechanical, Mechatronics, Robotics, Automation Engineering, or a related field. (Welcome PhD New Graduates)
- Technical Expertise: Strong understanding of lapping and polishing (CMP) within precision or semiconductor-grade manufacturing.
- Design & Automation: Proficient in CAD software with a working knowledge of motion control, sensors, and basic automation systems.
- Analytical Skills: Expert in data analysis using JMP, Python, or Excel and experienced in DOE (Design of Experiments).
- Soft Skills: A problem-solver with a strong analytical mindset and the ability to communicate effectively in English across technical and management teams.
Preferred Experiences:
- Hands-on experience in lapping/CMP of micro-scale components.
- Proven track record in CAD-based design and process automation.
- 14 Day - Annual Leave
- Guaranteed bonus
- Leave benefits
- Medical insurance
- กองทุนสำรองเลี้ยงชีพ
- ค่าน้ำมันรถ, ค่าเดินทาง
- ค่าเบี้ยเลี้ยง
- ทำงานสัปดาห์ละ 5 วัน
- ประกันสังคม
- ประกันสุขภาพ
- มีเวลาการทำงานที่ยืดหยุ่น
- โบนัสตามผลงาน/ผลประกอบการ
- โบนัสประจำปี
บริษัท ซีเกท เทคโนโลยี (ประเทศไทย) จำกัด










